by Bonding sheets are adhesive sheets used for bonding electronic components or assembling printed circuit boards. They provide electrical connectivity and enhance mechanical strength. Bonding sheets offer advantages like uniform bonding, cost-effectiveness, flexibility in design, and high thermal conductivity. The growing demand for miniaturized and lightweight electronic devices is driving the need for bonding sheets in applications such as smartphones, laptops, automotive electronics, and IoT devices.
The Global Bonding Sheet Market is estimated to be valued at US$ 446.07 Mn in 2024 and is expected to exhibit a CAGR of 7.5% over the forecast period 2024 to 2031.
Key Takeaways
Key players operating in the Global Bonding Sheet Market are Arisawa Manufacturing Co., Dexerials Corporation, DuPont, Fujikura Ltd., Hanwha Solutions Advanced Materials Division, Microcosm Technology Co., Ltd., Namics Corporation, Nikkan Industries Co.,Ltd, Nippon Mektron Ltd., Nitto Denko Corporation, Shin-Etsu Polymer Co., Ltd., Showa Denko Materials Co., Taiflex Scientific Co. Ltd., Toray Industries, Inc., Qinglong Adhesives, Orion Packart. These players are focusing on new product launches and global expansion to gain market share.
The smartphones, wearables, and other consumer electronics is fueling the bonding sheet market. Miniaturization of electronic components is driving the need for thin and flexible bonding sheets. Bonding sheets help achieve compact designs and enhance device functionality.
Asia Pacific dominates the Bonding Sheet Market Size led by China, Taiwan, South Korea, and Japan. This region is a major hub for electronics manufacturing and is witnessing rapid industrialization. Leading players are expanding their operations across Asia to tap the high growth potential in this region. Europe and North America are also important markets globally.
Market Key Trends
One of the key trends gaining traction in the bonding sheet market is the rising demand for bonding sheets made from thermally conductive materials. With technological advancement, there is increasing heat generated within miniaturized electronic devices. Thermally conductive bonding sheets help dissipate heat efficiently and improve the thermal management of devices. Material innovation leading to bonding sheets with higher thermal conductivity, electrical conductivity, and mechanical strength is expected to propel the market during the forecast period.
Porter’s Analysis
Threat of new entrants: Low capital requirements and established industry players make it difficult for new players to enter the market. Bargaining power of buyers: Buyers have moderate bargaining power due to availability of substitutes and presence of established players. Bargaging power of suppliers: A few well diversified suppliers exist globally lowering the threat from suppliers. Threat of new substitutes: Moderate threat from other adhesive sheet technologies and tapes used for similar applications. Competitive rivalry: Intense competition exists among leading players to gain more market share through product innovations and expansion to emerging regions.
Geographical regions:
Currently, Asia Pacific holds the largest share of the global bonding sheet market in terms value, owing to high electronics and automotive production in countries like China, Japan, South Korea and Taiwan.
Geographical regions with fastest growth: The bonding sheet market in Central and South America is projected to grow at the fastest rate during the forecast period. This is attributed to rapid industrialization and growth of end use industries in Brazil and Mexico. Countries in this region offer lucrative growth opportunities for manufacturers due to lower production costs.
*Note:
1. Source: Coherent Market Insights, Public sources, Desk research
2. We have leveraged AI tools to mine information and compile it
